What is Cu clip package? cu ch3coo 2

Power chips are attached to outside circuits via product packaging, and their performance depends on the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection refers to the electrical link on the upper surface area of the chip, which is normally aluminum bonding cable in traditional components. ^
Typical power module plan cross-section

Currently, industrial silicon carbide power components still mostly use the packaging innovation of this wire-bonded conventional silicon IGBT component. They face problems such as huge high-frequency parasitical parameters, insufficient heat dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict using silicon carbide semiconductors. The screen of outstanding efficiency. In order to resolve these issues and completely manipulate the huge prospective advantages of silicon carbide chips, several new product packaging innovations and options for silicon carbide power modules have emerged in recent years.

Silicon carbide power component bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually created from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold cables to copper wires, and the driving pressure is expense reduction; high-power tools have developed from light weight aluminum cords (strips) to Cu Clips, and the driving force is to improve product performance. The greater the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with standard bonding product packaging approaches, Cu Clip technology has the adhering to benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a specific degree, changes the common cable bonding technique between the chip and the pins. As a result, an unique package resistance value, higher existing circulation, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can totally conserve the cost of silver plating and poor silver plating.

3. The product look is totally consistent with regular products and is mainly used in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power products, and various other areas.

Cu Clip has 2 bonding approaches.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding method is more costly and intricate, but it can attain better Rdson and much better thermal impacts.

( copper strip)

Copper sheet plus cord bonding method

The resource pad utilizes a Clip approach, and the Gate uses a Cord technique. This bonding technique is a little less expensive than the all-copper bonding method, saving wafer area (appropriate to really small gateway locations). The process is easier than the all-copper bonding technique and can get better Rdson and much better thermal impact.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding cu ch3coo 2, please feel free to contact us and send an inquiry.

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